Method and apparatus for controlling local current to achieve uniform plating thickness

ABSTRACT

A process for electroplating metallic features of different density on a surface of a substrate comprises providing an electroplating bath having an anode, immersing the substrate into the electroplating bath, spaced from the anode, the substrate comprising a cathode. Positioned in the electroplating bath between the substrate and the anode, and adjacent to and separated from the substrate surface is a second cathode that includes a wire mesh screening portion having openings of different sizes conforming to the metallic features to be electroplated. The second cathode screening portion has openings of larger size adjacent areas of higher density of features to be electroplated and openings of smaller size adjacent areas of lower density of features to be electroplated. The process further includes impressing a current through the electroplating bath between the substrate and the anode, and between the second cathode and the anode, and electroplating the metallic features of different density onto the substrate.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to a method and apparatus for electroplatingmetals onto a substrate, for example, fine features used in theelectronics field, and, in particular, to improving the uniformity ofelectroplating feature thickness across regions of different featuredensity.

2. Description of Related Art

The electrical performance of a multi-chip module (MCM) is stronglyinfluenced by the thickness distribution of interconnect metal, i.e.,the thickness of deposited metal forming the particular interconnectfeature. Circuit pattern densities are not always uniformly distributedon a carrier surface. In some areas, the patterns can be very dense, forexample where the wires or other features are relatively closely spaced,while in other areas, the patterns can be very isolated, where the wiresor features are spaced relatively far apart. Using prior art platingtools and processes, the plated metal thickness can vary significantly.The resultant thin film interconnect structure of nonuniform thicknesscan severely impact the electrical performance and the production yieldsdue to high standard deviation of parametric measurements. These may befound in other electronics applications, for example, printed circuitboards and magnetic recording heads.

Paddle cells have been used which employ separate power supplies toimpress a current between an anode and the cathode comprising thesubstrate (workpiece) to be plated, and a current between the anode anda secondary cathode, or thief ring, which surrounds the substrate.Traditionally, plating in a paddle cell is controlled only by adjustingsubstrate and thief currents. There is little control on the localcurrents on a substrate. Another method to achieve uniformity includescreating dummy pads in the isolated areas. However, it may generate moreelectrical performance issue. Another approach was employed in Kaja etal. U.S. Ser. No. 09/699,909, filed on Oct. 30, 2000, which disclosedthe use of a woven metallic mesh of uniform spacing placed over thesubstrate and electrically connected to the thief plate. While the Kajaet al. method worked well in its intended use to plate only very fewlines on a substrate, it did not to solve the thickness uniformityproblem for areas having different feature density.

SUMMARY OF THE INVENTION

Bearing in mind the problems and deficiencies of the prior art, it istherefore an object of the present invention to provide a method andapparatus for improving electroplating on substrates having differentdensity of features to be plated.

It is another object of the present invention to provide a method andapparatus for improving uniformity of electroplating thickness betweenregions of different feature density.

It is yet another object of the present invention to provide a method tolocally influence plating currents for wide range of plating patterns toachieve uniform or intentional non-uniform thicknesses by design.

The above and other objects and advantages, which will be apparent toone of skill in the art, are achieved in the present invention which isdirected to, in a first aspect, a process for electroplating metallicfeatures of different density on a surface of a substrate comprisingproviding an electroplating bath having an anode therein, immersing thesubstrate into the electroplating bath, spaced from the anode, thesubstrate comprising a cathode, and positioning into the electroplatingbath between the substrate and the anode, and adjacent to and separatedfrom the substrate surface, a second cathode. The second cathodeincludes a screening portion having openings of different sizesconforming to the metallic features to be electroplated. The secondcathode screening portion has openings of larger size adjacent areas ofhigher density of features to be electroplated and has openings ofsmaller size adjacent areas of lower density of features to beelectroplated. The process further includes impressing a current throughthe electroplating bath between the substrate and the anode, and betweenthe second cathode and the anode, and electroplating the metallicfeatures of different density onto the surface of the substrate.

The process preferably further includes determining density of featuresto be electroplated by obtaining a plan of features to be electroplated,defining different areas on the plan of features, and calculatingfraction of area to be plated on the different areas on the plan offeatures. The process then further includes constructing the secondcathode by creating a mesh having openings of different sizescorresponding to the calculation of fraction of area to be plated on thedifferent areas on the plan of features.

In another aspect, the present invention is directed to a method ofmaking second cathode screens for use in a process for electroplatingmetallic features of different density on a surface of a substratecomprising providing a pattern or plan of metallic features of differentdensity to be electroplated onto a surface, identifying different areasof predetermined size on the pattern and determining for each of theidentified areas a fraction of the area to be electroplated. The methodthen includes determining differences, if any, of the fraction of thearea to be electroplated for adjacent areas and identifying differentdensities of metallic features to be electroplated based on differencesbetween adjacent areas of fraction of the area to be electroplated. Themethod subsequently includes forming a second cathode screen havingopenings of larger size adjacent areas of higher density of features tobe electroplated and having openings of smaller size adjacent areas oflower density of features to be electroplated.

In yet another aspect, the present invention is directed to an apparatusfor electroplating metallic features of different density on a surfaceof a substrate comprising an electroplating bath having an anodetherein, a substrate to be plated comprising a cathode immersed in theelectroplating bath, and spaced from the anode, and a second cathode.The second cathode includes a screening portion having openings ofdifferent sizes conforming to the metallic features to be electroplateddisposed in the electroplating bath between the substrate and the anode,and adjacent to and separated from the substrate surface. The secondcathode screening portion has openings of larger size adjacent areas ofhigher density of features to be electroplated and has openings ofsmaller size adjacent areas of lower density of features to beelectroplated. The apparatus further includes a first voltage source forimpressing a current through the electroplating bath between thesubstrate and the anode and a second voltage source for impressing acurrent through the electroplating bath between the second cathode andthe anode.

Preferably, the second cathode comprises a wire mesh and the openings onthe second cathode screen comprise spacing between wire in the wiremesh, such that the mesh has openings between the wires of larger sizeadjacent the areas of higher density of features to be electroplated andhas openings between the wires of smaller size adjacent areas of lowerdensity of features to be electroplated. More preferably, the wire meshis made of wire of about 0.001 to 0.05 in. diameter.

The metallic features to be electroplated comprise metallic wires ofdifferent spacing, and the areas of higher density of features to beelectroplated comprise metallic wires of closer spacing and the areas oflower density of features to be electroplated comprise metallic wires oflarger spacing. Preferably, the openings of larger size in the secondcathode screening portion are of reduced size compared to adjacent areasof higher density of features to be electroplated.

BRIEF DESCRIPTION OF THE DRAWINGS

The features of the invention believed to be novel and the elementscharacteristic of the invention are set forth with particularity in theappended claims. The figures are for illustration purposes only and arenot drawn to scale. The invention itself, however, both as toorganization and method of operation, may best be understood byreference to the detailed description which follows taken in conjunctionwith the accompanying drawings in which:

FIG. 1 is a cross-sectional, side elevational view of an electroplatingbath employing the preferred screening portion of the secondary cathodeof the present invention comprising a wire mesh with cutouts made inaccordance with substrate feature density.

FIG. 2 is a front elevational view showing the substrate and secondarycathode wire mesh of FIG. 1.

FIG. 3 is front elevational view of another secondary cathode wire meshwith cutouts in accordance with the present invention.

FIG. 4 is a top plan view of the plan of SCM features to beelectroplated onto a substrate and the identified areas for determiningdensity of the features in accordance with the present invention, alsoshowing plating thickness without using the secondary cathode of thepresent invention.

FIG. 5 is a top plan view of the plan of SCM features to beelectroplated onto a substrate, showing plating thickness after usingthe secondary cathode of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENT(S)

In describing the preferred embodiment of the present invention,reference will be made herein to FIGS. 1-5 of the drawings in which likenumerals refer to like features of the invention. Features of theinvention are not necessarily shown to scale in the drawings.

To improve the electrical test yields on plated substrates having avariety of plating feature densities, the present invention provides amethod and apparatus to minimize the thickness nonuniformity duringelectroplating for a broad range of pattern densities. The presentinvention involves the use a secondary cathode having a screeningportion preferably made of metal mesh screen that overlays on top of thesubstrate during plating. The mesh screen covers only those areas withsparse lines and leaves openings for areas with dense lines. Duringplating, the local current density on sparse line area is reduced due tothe over potential generated by plating on mesh which is electricallyconnected to a secondary power supply. The current density on the densearea, on the other hand, is increased since the overall plating currentto the substrate is fixed. By manipulating the shape of the screeningportion cut-outs and the current flowing to the mesh, thicknessuniformity of metal line can be improved.

FIG. 1 depicts the plating apparatus useful in connection with thepractice of the method of the present invention. An otherwiseconventional plating tank 34 contains a plating solution or bath 22 ofconventional composition for the type of features to be electroplated onthe substrate. Immersed in the plating bath is an anode 28, a substrateor workpiece 30 as a cathode, and a thief plate 32 as a secondarycathode. A power supply 24 is connected between anode 28 and substrate30 in order to create a voltage differential and impress a currentthrough the plating bath between the anode and substrate. Thief plate 32surrounds substrate 30 and is connected by a separate power supply 26 toanode 28. A voltage potential is created by power supply 26 betweenthief plate 32 and anode 28 to impress a different current value. As thecurrent flow between the anode and the substrate and the anode and thethief plate, the metallic features are plated on the substrate.

In accordance with the method of the present invention, there ispositioned in the electro-plating bath between the substrate and theanode, a screening portion 40 of the secondary cathode. The screeningportion of the secondary cathode can be made from a wide variety ofconductive materials. More preferably when wire mesh is employed, thewire comprises stainless steel, copper or the like. The screeningportion 40 is adjacent to and spaced from the surface of substrate 30and, as seen in FIG. 2, preferably comprises a wire mesh having a seriesof openings 42 a, 42 b, 42 c, 42 d and 42 e of larger size than thesurrounding mesh pattern of 41. As will be explained further below,these openings 42 a-e are formed over and adjacent the areas of thesubstrate which have plating features of higher density, as compared toother areas having lower density. The size of the openings may varybetween areas of different density. Preferably, the size of theparticular openings is determined by an algorithm which uses thegradient of density difference between adjacent areas to determinewhether and where an opening in the mesh 41 should be created.

A further example of a screening portion 40 of the secondary cathodemade in accordance with the invention is shown in FIG. 3. A wire mesh 41of relatively small wire spacing has formed within it openings 42 a-g oflarger size. These openings 42 a-g are disposed when used in the platingbath of FIG. 1, over the areas of higher density on the substrate to beelectroplated. The mesh wire size may range from 0.001″ to 0.05″ indiameter, and typically has about 35 to 68% of the area as openings.Other wire sizes and openings are as well applicable according toplating features. In addition to woven mesh, other kinds of masks, e.g.perforated metal sheets, can also be used as materials for the secondarycathode, or mesh thief.

The screening portion of the secondary cathode provides an additionalcontrol over local plating currents. The method to determine the sizeand number of openings of mesh is described in the following examples.The local currents would be modified to achieve uniformity or“non-uniformity”, as required by applications. The algorithm used todetermine the particular secondary cathode cutouts takes into accountthe different densities of features to be electroplated on thesubstrate. On a plan or chicklet showing the features such as lines orwires to be electroplated, one would first define areas or grids on thechicklet by overlaying a repeated concentric pattern, e.g., squares,with a predetermined size according to the plating pattern. For eacharea defined by the repeated pattern, one would calculate the fractionor percent of the area to be plated, defined as the plated area dividedby the total area. From these repeated measurements over the plan onewould then identify relatively dense areas and relatively isolated ornon-dense areas. Then, between each adjacent area, one would calculatethe difference or percent of change of area to be plated, and establisha gradient of pattern density change, for example, as either sharp, mildor very mild, or any other relative description. The secondary cathodewould then be made by creating mesh openings on the relatively denseareas of plating, as established by a gradient indicating a relativelysharp difference in pattern density between adjacent areas.

In a first example, the preparation of a secondary cathode for a singlechip module (SCM) 50 to be plated is depicted in Table 1 and FIG. 4. SCM50 is 27 mm on a side and shows the features actually electroplated onthe SCM. A grid of squares had been previously placed over a plan of thefeatures to be electroplated, and the fraction or percent of the area tobe plated was determined for each square. For example, in the SCM ofoverall size 27 mm on a side depicted here, the squares may have a sizeof 0.5 mm. In a larger substrate, for example a multi-chip module (MCM)or large panel (LP) of overall size 110 mm or more on a side, the gridsize may be 1 mm. After comparing the change in plating density betweenadjacent squares of the SCM in FIG. 4, it was determined that aconcentric square area 52, which was 13 mm on a side, identified an areawith a density of 41% of the area to be plated and was designated as themost dense area of the plan. It was also determined that a concentricsquare area 54 of 17 mm on a side identified an area between squares 52and 54 having a density of 35% of the area to be plated, which wasslightly less dense than square 52. Finally, the area between square 54and square 56 (27 mm on a side) had the lowest density, 8% of the areato be plated, and was designated as an isolated area. Table 1 belowindicates these measurements, as well as the percent change of densitybetween adjacent areas bounded by squares 52 and 54.

TABLE 1 L (Length % Change between of Side of Square) % Area PlatedAdjacent Areas 13 mm 41%  6% 17 mm 35% (dense area) 27% 27 mm  8%(isolated area)

Table 2 below shows the characterization of the relative differences indensities of areas to be plated for SCM 50 in FIG. 4. A 0-10% change inplating density was characterized as very mild, a 10-25% change indensity was characterized as mild, and a change in density greater than25% was characterized as sharp.

TABLE 2 % Change between Adjacent Areas Gradient L (mm) of Square  0-10very mild 13 10-25 mild 26 or higher sharp 17

Because of the sharp gradient of 27% difference in pattern density alongthe boundary of square 54 (17 mm on a side), it was determined that amesh opening would be created adjacent that area. The actual meshopening was calculated by reducing the size of the opening compared tothe size of the area exhibiting the sharp gradient, so that the meshwould cover a portion along the edges of the dense area to balance theconvective flow of electroplating solution on the features duringplating. For example, a size reduction of up to 50% or more may beemployed, for example about 10 to 20%, or 20 to 50% less, as may bereadily determined by those of ordinary skill in this art without undueexperimentation. In the example of FIG. 4, the mesh opening was reducedabout 15%, or 2.5 mm from the 17 mm size of square 54, to arrive at amesh opening of 14.5 mm.

The final plating thickness, in micrometers (μm), on SCM 50 as platedwithout the secondary cathode of the present invention is shown on thedifferent areas of the SCM in FIG. 4. By way of comparison, the finalplating thickness as plated using the secondary cathode of the presentinvention is shown on the different areas of SCM 50 in FIG. 5. Theuniformity of plating thickness is much improved in the SCM of FIG. 5.

Other tests have also shown improvement in plating thickness uniformityin substrates having different plating densities, as described in Table3 below showing a comparison of copper plating thickness uniformitybetween a substrate plating using thief ring without a mesh, a solidmesh in accordance with the Kaja et al. application, and a mesh withcutouts made in accordance with the present invention:

TABLE 3 Mesh without Mesh with Average Cu Thickness cut-outs cut-outs(μm) No Mesh (Kaja et al.) (Invention) Dense area (center) 5.06 5.025.60 Dense area (edge) 6.17 6.21 5.83 Isolated area 6.63 6.49 5.65Corner/perimeter 6.13 6.32 5.77 Max-Min 1.57 1.47 0.23

The measurements of average Cu thickness show much less deviation in themethod of the present invention as compared with prior methods. Otherdata has shown that the average thickness distribution between dense andsparse areas has been improved from 28% to 4% on an MCM, and from 25% to12% on a SCM.

The dramatic improvement of thickness control enabled by this inventionalso leads to a very significantly tighter distribution in finalparametric performance of SCM and MCM modules, as well as, increasedyields. A summary of electrical measurements on MCM modules plated inaccordance with the prior art method of using the thief ring without amesh, and the method of the present invention is shown below in Table 4:

TABLE 4 Parametric average Standard deviation MCM (w/o mesh) 2.1350.1153 MCM (Pres. Invention) 2.193 0.0753

The electrical performance can be improved since there is a 35%reduction in standard deviation. This method has also been demonstratedon other MCM and SCM products as well.

The process of the present invention may be used for electroplating avariety of industrial plating applications, for example, printed circuitboard/laminates, hyper ball grid arrays (BGAs) plating, surface laminarcircuits (SLCs), electroformed masks, and thin film inductive magneticrecording heads.

While the present invention has been particularly described, inconjunction with a specific preferred embodiment, it is evident thatmany alternatives, modifications and variations will be apparent tothose skilled in the art in light of the foregoing description. It istherefore contemplated that the appended claims will embrace any suchalternatives, modifications and variations as falling within the truescope and spirit of the present invention.

1. A process for electroplating metallic features of different densityon a surface of a substrate comprising: providing an electroplating bathhaving an anode therein; immersing the substrate into the electroplatingbath, spaced from the anode, the substrate comprising a cathode;positioning into the electroplating bath between the substrate and theanode, and adjacent to and separated from the substrate surface, asecond cathode including a screening portion having openings ofdifferent sizes conforming to the metallic features to be electroplated,the second cathode screening portion having openings of larger sizeadjacent areas of higher density of features to be electroplated andhaving openings of smaller size adjacent areas of lower density offeatures to be electroplated; and impressing a current through theelectroplating bath between the substrate and the anode, and between thesecond cathode and the anode, and electroplating the metallic featuresof different density onto the surface of the substrate.
 2. The processof claim 1 wherein the second cathode comprises a wire mesh.
 3. Theprocess of claim 1 wherein the second cathode screening portioncomprises a wire mesh, the mesh having openings between the wires oflarger size adjacent the areas of higher density of features to beelectroplated and having openings between the wires of smaller sizeadjacent areas of lower density of features to be electroplated.
 4. Theprocess of claim 1 wherein the metallic features to be electroplatedcomprise metallic wires of different spacing, and the areas of higherdensity of features to be electroplated comprise metallic wires ofcloser spacing and the areas of lower density of features to beelectroplated comprise metallic wires of larger spacing.
 5. The processof claim 2 wherein the wire mesh is made of wire of about 0.001 to 0.05in. diameter.
 6. The process of claim 1 wherein the openings of largersize in the second cathode screening portion are of reduced sizecompared to adjacent areas of higher density of features to beelectroplated.
 7. A process for electroplating metallic features ofdifferent density on a surface of a substrate comprising: determiningdensity of features to be electroplated by obtaining a plan of featuresto be electroplated, defining different areas on the plan of features,and calculating fraction of area to be plated on the different areas onthe plan of features; providing an electroplating bath having an anodetherein; immersing the substrate into the electroplating bath, spacedfrom the anode, the substrate comprising a cathode; positioning into theelectroplating bath between the substrate and the anode, and adjacent toand separated from the substrate surface, a second cathode including ascreening portion having openings of different sizes conforming to themetallic features to be electroplated, the second cathode screeningportion having openings of larger size adjacent areas of higher densityof features to be electroplated and having openings of smaller sizeadjacent areas of lower density of features to be electroplated; andimpressing a current through the electroplating bath between thesubstrate and the anode, and between the second cathode and the anode,and electroplating the metallic features of different density onto thesurface of the substrate.
 8. The process of claim 7 wherein the secondcathode comprises a wire mesh.
 9. The process of claim 7 wherein thesecond cathode screening portion comprises a wire mesh, the mesh havingopenings between the wires of larger size adjacent the areas of higherdensity of features to be electroplated and having openings between thewires of smaller size adjacent areas of lower density of features to beelectroplated.
 10. The process of claim 7 wherein the metallic featuresto be electroplated comprise metallic wires of different spacing, andthe areas of higher density of features to be electroplated comprisemetallic wires of closer spacing and the areas of lower density offeatures to be electroplated comprise metallic wires of larger spacing.11. The process of claim 8 wherein the wire mesh is made of wire ofabout 0.001 to 0.05 in. diameter.
 12. The process of claim 7 wherein theopenings of larger size in the second cathode screening portion are ofreduced size compared to adjacent areas of higher density of featureselectroplated.
 13. The process of claim 7 further including constructingthe second cathode by creating a mesh having openings of different sizescorresponding to the calculation of fraction of area to be plated on thedifferent areas on the plan of features.